Introduction
The heat sink is mounted to the board by spring loaded shoulder screws. The compression load from the springs applies the appropriate mounting force to the heat sink and generates the pressure required for proper thermal interface material performance.
- Springs apply compression load to the solder balls instead of undesirable tension or shear.
- Higher performance thermal interface materials like grease or phase change material can be used instead of tapes or adhesives.
- Rework is easier when compared to heat sinks attached by tapes or adhesives.