| Gap Filling Material | |||||
| Model Name | Manufacturer | Sheet Size | Thickness | Thermal conductivity (W/mK) | Thermal impedance (degC-in2/W) |
|---|---|---|---|---|---|
| T-Pli 210 | Laird Technologies (formerly Thermagon) | 8"x8" | .010" | 6 | 0.16 (@ 20psi) |
| T-Pli 220 | Laird Technologies (formerly Thermagon) | 8"x8" | .020" | 6 | 0.21 (@ 20psi) |
| T-flex 640 | Laird Technologies (formerly Thermagon) | 9"x9" | .040" | 3 | 0.62 (@ 10psi) |
| Phase Change Material | ||||||
| Model Name | Manufacturer | Sheet Size | Thickness | Thermal conductivity (W/mK) | Thermal impedance (degC-in2/W) | Memo |
|---|---|---|---|---|---|---|
| T-pcm 905 | Laird Technologies (formerly Thermagon) | 9"x9" | .005" | 0.7 | 0.048 (@ 10psi) | |
| Hi-Flow225FT | Bergquist | 1.75"x1.75" | .004" | 0.7 | 0.10 (@25psi) | Reworkable |
| Thermal Grease | ||||||
| Model Name | Manufacturer | Specific Gravity | Weight | Thermal conductivity (W/mK) | Operating Temperature | Memo |
|---|---|---|---|---|---|---|
| YG6260-5 | Momentive Performance Materials (formerly GE Toshiba Silicones) | 2.5 | 5 | 0.84 W/mK | -50degC - 150 degC | metal oxide filled silicone oil compound |
| Adhesive Tape | ||||||
| Model Name | Manufacturer | Sheet Size | Thickness | Thermal conductivity (W/mK) | Thermal impedance (degC-in2/W) | Memo |
|---|---|---|---|---|---|---|
| T411 | Chomerics | 6"x12" | .011" | - | 1.0(@ < 1 psi) | |
| T412 | Chomerics | 6"x12" | .009" | 1.40 | 0.25(@ < 1 psi) | Attachment to Ceramic or Metal components |
| BP105 | Bergquist | 1.38"x1.38" (35mm sq.) | .005" | 0.8 | 0.86(@100 psi) | BP105 = Bond-Ply100 tape .005" thickness |
| 8815 | 3M | 4"x12" | 0.015" | 0.60 | 1.20 | |
© 2007 Alpha Novatech, Inc.