Online Catalog

Accessory - Thermal Interface Material

Introduction

Thermal interface material fills the small gaps and irregularities between the heat sink and heat source to minimize the interface thermal resistance. The following interface materials are typically available with our products. These materials can also be purchased separately.
Gap Filling Material
These materials have high thermal conductivity and are soft, allowing them to fill any large gaps between the heat sink and heat source.
Phase Change Material
These materials begin to soften and flow at a certain temperature, filling the microscopic irregularities between heat sink and heat source, reducing the thermal interface resistance.
Thermal Grease
Thermally conductive grease. Compared to other type of thermal interface materials, grease offers the highest performance.
Adhesive Tape
Thermally conductive adhesive tapes are widely used due to the ease of heat sink attachment. Performance can be good, although not as high as the performance of phase change material or grease.
Note : The shear strength and thermal performance of an adhesive tape is dependant on many factors, such as the flatness and cleanness of the contact surface. The application instructions from the manufacturer (pressure versus time and temperature), should be followed to ensure adhesion. Please refer to the specifications/instructions from each tape manufacturer.

Specification

Gap Filling Material
Model NameManufacturerSheet SizeThicknessThermal conductivity
(W/mK)
Thermal impedance
(degC-in2/W)
T-Pli 210Laird Technologies
(formerly Thermagon)
8"x8".010"60.16 (@ 20psi)
T-Pli 220Laird Technologies
(formerly Thermagon)
8"x8".020"60.21 (@ 20psi)
T-flex 640Laird Technologies
(formerly Thermagon)
9"x9".040"30.62 (@ 10psi)
(Thickness and size are in inches. 1" is 25.4mm)

Phase Change Material
Model NameManufacturerSheet SizeThicknessThermal conductivity
(W/mK)
Thermal impedance
(degC-in2/W)
Memo
T-pcm 905Laird Technologies
(formerly Thermagon)
9"x9".005"0.70.048
(@ 10psi)
 
Hi-Flow225FTBergquist1.75"x1.75".004"0.70.10
(@25psi)
Reworkable

Thermal Grease
Model NameManufacturerSpecific GravityWeightThermal conductivity
(W/mK)
Operating TemperatureMemo
YG6260-5Momentive Performance Materials
(formerly GE Toshiba Silicones)
2.550.84 W/mK -50degC - 150 degCmetal oxide filled silicone oil compound

Adhesive Tape
Model NameManufacturerSheet SizeThicknessThermal conductivity
(W/mK)
Thermal impedance
(degC-in2/W)
Memo
T411Chomerics6"x12".011"-1.0(@ < 1 psi) 
T412Chomerics6"x12".009"1.400.25(@ < 1 psi)Attachment to Ceramic or Metal components
BP105Bergquist1.38"x1.38"
(35mm sq.)
.005"0.80.86(@100 psi)BP105 = Bond-Ply100 tape .005" thickness
88153M4"x12"0.015"0.601.20 

© 2007 Alpha Novatech, Inc.