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The following parts are designed for Intel's FC-PGA2 package, which thickness is 1.8mm thicker than FC-PGA.

CL57GT	PAL60 heat sinks can be attached to FC-PGA2 socket by using this CL57GT clip.
CL57HT	PEP66 heat sinks can be attached to FC-PGA2 socket by using this CL57HT clip.
CL57LT	UB60, UBC60 heat sink can be attached to FC-PGA2 socket by using this CL57LT clip.
PAL14U	The PAL14U is a fan heat sink which is suitable for low profile system, such as 1U system. The total heat sink height is 13.5mm. Since FC-PGA2 chips have an IHS(Integrated Heat Spreader), from the point of cost performance, the heat sink are made from all aluminum.   Heat Sink Material : A6063 , Black Anodize   Size :60 x 60 x 13.5 mm Height   FAN 60 x 60 x 10 mm Thick

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