Alpha has expanded its wide range of off-the-shelf products to meet customer requirements.
Electronic devices have become more compact, often requiring the use of smaller heatsinks. At the same time, PCBs have become more densely populated. These factors can make it difficult to properly cool all the devices on a PCB.
TL series heatsinks feature a low-profile, low-pressure drop fin pattern while providing high performance and low thermal resistance. The TL series combines thin fins, a wide fin gap, and a base thickness of just 1.5mm to achieve these design goals. By leveraging our manufacturing innovations and expertise, we can offer a heat sink series for applications that require low thermal resistances under conditions of limited airflow and space.
|Model name||Base size (mm)||Height (mm)||Base thickness (mm)|
|TL19||19 x 19||4, 5, 6||1.5|
|TL25||25 x 25|
|TL30||30 x 30|
|TL35||35 x 35|
|TL40||40 x 40|
Please visit our online catalog - TL series for additional details.
Shipments will begin on 07/01/2020.
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