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Vapor Chamber

VC Series
  • This series features high thermal conductivity vapor chambers.
  • Vapor Chambers quickly spread high heat density over a wide area, enhancing cooling efficiency.

Comparison of Temperature Trends between the Vapor Chamber (VC120) and a Copper Plate.

Vapor Chamber

Vapor Chamber Structure

The inner wall of the thin copper container is bonded with a copper mesh, and a porous wick is placed at the heat source. The working fluid, pure water sealed under vacuum conditions, continuously evaporates and condenses, circulating through the wick by capillary action, efficiently dissipating heat.

The video on the left shows the temperature distribution when a 15x25mm heater is in contact with a product of 120mm square and 3mm thickness.
Compared to copper, the vapor chamber (VC120)
maintains a more uniform temperature over
a wider area, effectively suppressing
the temperature rise at
the heat source.

If the shape or size does not meet your requirements, please contact our sales department.

Vapor Chambers
VC series Vapor Chamber

Supplement

  • Working temperature range: 10 - 90°C.
Model Size
W x L (mm)		 Hole Pitch
X x Y (mm)		 Hole Dia
⌀H		 Weight
(g)		 Download Availability / Price / Order
Data sheet Others
80 x 80 70 x 70 5.5 87.3 catalog RoHS REACH DXF
90 x 90 80 x 80 114.3 catalog
100 x 100 90 x 90 142.5 catalog
120 x 120 110 x 110 203.4 catalog
106 x 70 96 x 60 5.9 101.1 catalog
/measurement data mark

Measurement setup 1 (Bare die / Water cooling)

Vapor Chamber Measurement Setup
A vapor chamber was placed on a heater with a thermocouple, and its top surface was cooled using a water-cooling block. The thermal resistance value was based on the temperature rise of the heater relative to the water inlet temperature. Thermal grease was applied at each interface.
Thermal resistance (°C/W) : (Tj - Tw) / Watts
Model Power
100(W)		 Power
200(W)		 Power
400(W)
VC80 0.094 0.088 0.08
VC90 0.079 0.074 0.069
VC100 TBD TBD TBD
VC120 0.078 0.073 0.066
VC106x70 0.091 0.086 0.077
Without vapor chamber 0.104 0.099 0.094

Heat source size : 15 x 25 (mm), Water flow rate 4.0 (L/min)

Measurement setup 2 (With Lid / Water cooling)

Vapor Chamber Measurement Setup
A copper plate assuming a heater cover was placed between a heater with thermocouples and a vapor chamber, and the top surface of the vapor chamber was cooled by a water-cooling block. The thermal resistance value was based on the temperature rise of the heater relative to the water inlet temperature. Thermal grease was applied at each interface.
Thermal resistance (°C/W) : (Tc - Tw) / Watts
Model Power
55(W)		 Power
200(W)
VC80 0.267 0.223
Same size copper 0.329 0.300
VC90 0.267 0.224
Same size copper 0.318 0.294
VC100 0.265 0.219
Same size copper 0.324 0.298
VC120 0.251 0.213
Same size copper 0.334 0.301
VC106x70 0.265 0.225
Same size copper 0.334 0.304

Heat source size : 12 x 22 (mm), Water flow rate 0.6 (L/min)

Measurement setup 3 (Bare die / Active fan)

Vapor Chamber Measurement Setup
A vapor chamber was placed on top of a heater with thermocouples attached, and its top surface was cooled by a heat sink with a fan. Thermal resistance value was based on the temperature rise due to the heater relative to the temperature of the incoming air from the top of the fan. Thermal grease was applied at each interface.
Thermal resistance (°C/W) : (Tj - Ta) / Watts
Model Power
55(W)		 Power
200(W)
FH10040A(base4t) + VC90 + M92P 0.404 0.384
FHC10040A + M92P 0.494 0.489
FH10040A + M92P 0.610 0.609

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