MicroForging can produce fins of almost any shape, including elliptical and hexagonal.
The fin pattern and geometry can be optimized for active and passive applications, including natural convection. Our
patented copper embedding process offers a significant performance improvement in applications with a small heat source
size and high heat dissipation.
Product information can be downloaded from our online catalog, including
performance data, drawing/CAD files, price/delivery, RoHS/REACH, and more.
If additional information is required, we
will quickly respond to all requests.
Our extensive selection of attachment hardware allows customers to easily tailor a heat sink to a specific
application. This includes mounting method, attachment force, board real estate limitations, etc..
Our Anchor Pins only require 1.80mm diameter holes in the PCB. This is the smallest footprint
of any mechanical attachment method that transfers the attachment forces directly to the PCB.